Leha li-lasers tse potlakileng li bile teng ka lilemo tse mashome, lits'ebetso tsa indasteri li holile ka potlako lilemong tse mashome a mabeli tse fetileng.Ka 2019, boleng ba mmaraka ba ultrafastlisebelisoa tsa laserts'ebetso e ne e ka ba limilione tse 460 tsa US, ka sekhahla sa kholo ea selemo le selemo sa 13%.Libaka tsa ts'ebeliso moo li-laser tsa ultrafast li sebelisitsoeng ka katleho ho sebetsana le lisebelisoa tsa indasteri li kenyelletsa ho etsoa le ho lokisoa ha photomask indastering ea semiconductor hammoho le silicon dicing, ho khaola likhalase / scribing le (indium tin oxide) ho tlosoa ha filimi ea ITO ho lisebelisoa tsa motlakase tsa bareki tse kang liselefouno le matlapa. , ho romella melaetsa ea piston bakeng sa indasteri ea likoloi, tlhahiso ea methapo ea pelo le lisebelisoa tsa microfluidic bakeng sa indasteri ea bongaka.
01 Ho etsa le ho lokisa Photomask indastering ea semiconductor
Li-lasers tsa Ultrafast li ne li sebelisoa ho e 'ngoe ea likopo tsa pele tsa indasteri ho sebetsa thepa.IBM e tlalehile ts'ebeliso ea femtosecond laser ablation tlhahiso ea photomask lilemong tsa bo-1990.Ha ho bapisoa le nanosecond laser ablation, e ka hlahisang tšepe ea tšepe le tšenyo ea khalase, li-mask tsa laser tsa femtosecond ha li bontše tšepe ea tšepe, ha ho na tšenyo ea khalase, joalo-joalo Melemo.Mokhoa ona o sebelisetsoa ho hlahisa li-circuits (ICs).Ho hlahisa IC chip ho ka hloka limaske tse 30 mme ho bitsa $100,000.Femtosecond laser process e ka sebetsana le mela le lintlha tse ka tlase ho 150nm.
Setšoantšo sa 1. Ho etsa le ho lokisa Photomask
Setšoantšo sa 2. Liphetho tsa ntlafatso ea mekhoa e fapaneng ea mask bakeng sa lithography e feteletseng ea ultraviolet
02 Ho itšeha ka silika indastering ea semiconductor
Silicon wafer dicing ke ts'ebetso e tloaelehileng ea tlhahiso indastering ea semiconductor mme hangata e etsoa ka mokhoa oa ho qoela ka mochini.Mabili ana a sehang hangata a hlahisa li-microcracks 'me ho thata ho khaola li-wafers tse tšesaane (mohlala, botenya <150 μm).Ho itšeha ka laser ho 'nile ha sebelisoa indastering ea semiconductor ka lilemo tse ngata, haholo-holo bakeng sa li-wafers tse tšesaane (100-200μm),' me li etsoa ka mehato e mengata: laser grooving, e lateloa ke karohano ea mechine kapa ho itšeha ka bolotsana (ke hore, beam ea laser e ka hare. the silicon scribing) e lateloang ke karohano ea theipi ea mochini.Laser ea nanosecond pulse e khona ho sebetsana le li-wafers tse 15 ka hora, 'me laser ea picosecond e ka sebetsana le li-wafers tse 23 ka hora, ka boleng bo holimo.
03 Ho seha/ho ngola likhalase indastering ea lisebelisoa tsa elektroniki tse ka sebelisoang
Lits'oants'o tse ts'oaroang le likhalase tse sireletsang tsa mehala ea cellular le lilaptop li ntse li fokola 'me libopeho tse ling tsa geometri li kobehile.Sena se etsa hore ho be thata ho itšeha ka mokhoa o tloaelehileng.Li-lasers tse tloaelehileng hangata li hlahisa boleng bo bobe bo sehiloeng, haholo-holo ha likhalase tsena li koaletsoe ka mekhahlelo e 3-4 'me likhalase tse sireletsang tse ka holimo tsa 700 μm li halefile, tse ka robehang ka khatello ea maikutlo.Li-lasers tsa Ultrafast li bonts'itsoe hore li khona ho khaola likhalase tsena ka matla a matle a holimo.Bakeng sa seha se seholo sa phanele e bataletseng, laser ea femtosecond e ka shebana le bokamorao ba letlapa la khalase, ea hopa bokahare ba khalase ntle le ho senya bokaholimo bo ka pele.Khalase e ka rojoa ka mokhoa oa mochini kapa oa mocheso ho latela mohlala oa lintlha.
Setšoantšo sa 3. Picosecond ultrafast laser khalase ho itšeha ka sebōpeho se khethehileng
04 Meetso ea piston indastering ea likoloi
Lienjineri tsa likoloi tse bobebe li entsoe ka li-alloys tsa aluminium, tse sa ts'oaneng joalo ka tšepe ea tšepe.Boithuto bo fumane hore ts'ebetso ea laser ea femtosecond ea masela a piston ea koloi e ka fokotsa likhohlano ka 25% hobane maloanlahla le oli li ka bolokoa hantle.
Setšoantšo sa 4. Femtosecond laser processing ea li-piston tsa likoloi tsa likoloi ho ntlafatsa ts'ebetso ea enjene
05 Ho etsa li-coronary stent indastering ea bongaka
Li-coronary stents tse limilione li kenngoa ka har'a methapo ea 'mele ea pelo ho bula mocha hore mali a phalle methapong e 'ngoe e hoelehileng, e pholosang bophelo ba limilione selemo le selemo.Li-coronary stents hangata li entsoe ka tšepe (mohlala, tšepe e sa hloekang, motsoako oa memori oa nickel-titanium, kapa morao tjena cobalt-chromium alloy) mesh ea terata e bophara ba strut e ka bang 100 μm.Ha ho bapisoa le laser cutting ea nako e telele, melemo ea ho sebelisa lasers ea ultrafast ho khaola li-brackets ke boleng bo phahameng bo khaotsoeng, ho qeta holimo holimo, le litšila tse fokolang, tse fokotsang litšenyehelo tsa morao-rao.
06 Ho etsoa ha lisebelisoa tsa Microfluidic bakeng sa indasteri ea bongaka
Lisebelisoa tsa Microfluidic li sebelisoa hangata indastering ea bongaka bakeng sa tlhahlobo ea mafu le tlhahlobo ea mafu.Tsena hangata li etsoa ka ente ea micro-ente ea likarolo ka bomong ebe li tlamahanngoa ka gluing kapa welding.Ultrafast laser e entsoeng ka lisebelisoa tsa microfluidic e na le molemo oa ho hlahisa li-microchannel tsa 3D ka har'a lisebelisoa tse bonaletsang joalo ka khalase ntle le tlhoko ea likhokahano.Mokhoa o mong ke oa ultrafast laser fabrication ka hare ho khalase e ngata e lateloa ke etching ea lik'hemik'hale e metsi, 'me e' ngoe ke femtosecond laser ablation ka hare ho khalase kapa polasetiki ka metsing a hloekisitsoeng ho tlosa litšila.Mokhoa o mong ke oa ho kenya liteishene tsa mochini bokaholimo ba khalase ebe o li tiisa ka sekoaelo sa khalase ka femtosecond laser welding.
Setšoantšo sa 6. Femtosecond laser-induced selective etching ho lokisa likanale tsa microfluidic ka hare ho lisebelisoa tsa khalase.
07 Ho cheka hanyenyane ha molomo oa ente
Femtosecond laser microhole machining e nkile sebaka sa micro-EDM ho lik'hamphani tse ngata 'marakeng oa ente ea khatello e phahameng ka lebaka la ho fetoha ha maemo ho feto-fetohang ha li-profiles tsa phallo le linako tse khutšoane tsa mochini.Bokhoni ba ho laola ka bo bona boemo ba ho tsepamisa maikutlo le ho thetheha ha sebanka ka hlooho ea skena e etelletseng pele ho lebisitse ho moralo oa li-profiles tsa aperture (mohlala, barrel, flare, convergence, divergence) tse ka khothaletsang atomization kapa ho kenella ka phaposing ea mollo.Nako ea ho cheka e itšetlehile ka molumo oa ablation, ka botenya ba ho phunya ba 0.2 - 0.5 mm le bophara ba lesoba la 0.12 - 0.25 mm, ho etsa mokhoa ona ka makhetlo a leshome ka potlako ho feta micro-EDM.Microdrilling e etsoa ka mekhahlelo e meraro, ho kenyelletsa le ho phunya le ho phethoa ha masoba a pilot.Argon e sebelisoa e le khase e thusang ho sireletsa borehole ho tsoa ho oxidation le ho sireletsa plasma ea ho qetela nakong ea mekhahlelo ea pele.
Setšoantšo sa 7. Femtosecond laser e sebetsa ka mokhoa o nepahetseng ka ho fetisisa oa lesoba la taper le kentsoeng bakeng sa enjene ea enjene ea diesel.
08 Mongolo oa laser o potlakileng haholo
Lilemong tsa morao tjena, molemong oa ho ntlafatsa ho nepahala ha machining, ho fokotsa tšenyo ea thepa, le ho eketsa ts'ebetso ea ts'ebetso, lefapha la micromachining butle-butle le fetohile sepheo sa bafuputsi.Ultrafast laser e na le melemo e fapaneng ea ts'ebetso e joalo ka tšenyo e tlase le ho nepahala ho phahameng, e fetohileng sepheo sa ho khothaletsa nts'etsopele ea theknoloji ea ho sebetsa.Ka nako e ts'oanang, li-lasers tsa ultrafast li ka sebetsa ka lisebelisoa tse fapaneng, 'me tšenyo ea thepa ea laser e boetse e le tataiso e kholo ea lipatlisiso.Ultrafast laser e sebelisoa ho tlosa lisebelisoa.Ha matla a matla a laser a phahame ho feta moeli oa ablation oa thepa, bokaholimo ba thepa e tlositsoeng bo tla bontša sebopeho sa micro-nano se nang le litšobotsi tse itseng.Lipatlisiso li bontša hore Sebopeho sena se khethehileng sa holim'a metsi ke ntho e tloaelehileng e etsahalang ha lisebelisoa tsa laser processing.Ho lokisoa ha meaho ea li-micro-nano tse kaholimo ho ka ntlafatsa thepa ea thepa ka boyona hape ho nolofaletsa nts'etsopele ea lisebelisoa tse ncha.Sena se etsa hore ho lokisoa ha meaho ea "micro-nano" ka laser ea ultrafast e be mokhoa oa tekheniki o nang le bohlokoa ba nts'etsopele.Hajoale, bakeng sa lisebelisoa tsa tšepe, lipatlisiso tse mabapi le mongolo oa ultrafast laser surface texturing li ka ntlafatsa thepa ea ho kolobisa holim'a tšepe, ho ntlafatsa khohlano ea holim'a metsi le thepa ea ho roala, ho ntlafatsa ho khomarela liphahlo, le ho ata le ho khomarela lisele.
Setšoantšo sa 8. Superhydrophobic thepa ea holim'a silicon e lokiselitsoeng ka laser
Joalo ka theknoloji ea ho sebetsa ka mokhoa o ikhethileng, ts'ebetso ea laser ea ultrafast e na le litšobotsi tsa sebaka se senyenyane se anngoeng ke mocheso, ts'ebetso e se nang moeli ea ho sebelisana le lisebelisoa, le ts'ebetso e phahameng ea tharollo e fetang moeli oa diffraction.E khona ho hlokomela ts'ebetso ea boleng bo holimo le bo nepahetseng ba micro-nano ea lisebelisoa tse fapaneng.le sebopeho sa sebopeho sa micro-nano se nang le mahlakore a mararo.Ho fihlella tlhahiso ea laser ea lisebelisoa tse khethehileng, meaho e rarahaneng le lisebelisoa tse ikhethang ho bula mekhoa e mecha ea ho etsa li-micro-nano.Hajoale, laser ea femtosecond e sebelisitsoe haholo mafapheng a mangata a mahlale a morao-rao: laser ea femtosecond e ka sebelisoa ho lokisa lisebelisoa tse fapaneng tsa optical, joalo ka li-microlens arrays, mahlo a metsoako ea bionic, li-waveguide tsa optical le metasurfaces;e sebelisa ho nepahala ha eona ho phahameng, qeto e phahameng le Ka bokhoni ba ho sebetsa ka mahlakoreng a mararo, laser ea femtosecond e ka lokisetsa kapa ea kopanya li-chips tsa microfluidic le optofluidic tse kang likarolo tsa microheater le likanale tsa microfluidic tse tharo-dimensional;ho phaella moo, laser ea femtosecond e ka boela ea lokisetsa mefuta e fapaneng ea li-micro-nanostructures holim'a metsi ho finyella anti-reflection, anti-reflection, super-hydrophobic, anti-icing le mesebetsi e meng;eseng hoo feela, laser ea femtosecond e sebelisitsoe le lefapheng la biomedicine, e bonts'a ts'ebetso e ikhethang mafapheng a kang li-micro-stents tsa bioloji, li-substrates tsa cell culture le imaging microscopic biological.Litebello tse pharaletseng tsa kopo.Hajoale, masimo a kopo ea femtosecond laser process a ntse a eketseha selemo le selemo.Ntle le li-micro-optics tse boletsoeng ka holimo, li-microfluidics, li-micro-nanostructures tse sebetsang ka bongata le lisebelisoa tsa boenjiniere ba biomedical, e boetse e phetha karolo e kholo likarolong tse ling tse ntseng li hlaha, tse kang ho lokisetsa metasurface., tlhahiso ea li-micro-nano le polokelo ea lintlha tse ngata tsa optical, joalo-joalo.
Nako ea poso: Apr-17-2024
